Resolve Overheating, Sony Xperia Z5 Wear 2 Pipe Cooling & Thermal Paste

Sony still retaining Snadpragon 810 chipset to be in their flagship phone. In fact, this chipset has been reported to have overheating. What makes Sony confident using this chipset after S810 sacrificing his two mobile phones?

When Sony launched the Sony Xperia and Xperia Z3 + Z4, no doubt both overheating and reported that many netizens via social media. Cause, none other than 810 Snapdragon chipset embedded therein.

Now, Sony re-launch their greatest flagship smartphone Sony Xperia Z5 which again still maintain Snapdragon chipset 810. What Sony did not give up using high-end chipset Qualcomm? Or Sony has another solution that can reduce the heat of the Snapdragon 810?

Teardown picture above might answer. As you can see Sony appears to have a solution in dealing with the heat generated Snapdragon chipset 810. If you are a mobile phone technician, you probably realize something strange in the innards of the Sony Xperia Z5 above.

Yes, Sony was using the same solution as used in laptop devices in reducing the heat of the CPU. That is by using cooling pipes and Thermal Paste. But not just one, Sony put two cooling pipes to remove the heat produced by the CPU.

Given Sony Xperia Z5 is a phone that carries a screen resolution of 4K, 810 Snapdragon CPU performance should be forced to a high level. In fact, most vendors are using Snapdragon 810 into his cell phone as OnePlus 2 overcome the problem of overheating by clicking underclock performance Snapdragon 810. But Sony is precisely this chipset force in order to work optimally. Sony certainly confident with solutions that he applied in the Sony Xperia Z5.

But if this solution really works? For now, we can not prove anything about it because the unit has not reached our hands. However, consumers will soon prove it.